| Speed of die attach | ≥60ms UPH: 60K/h (actual production capacity depends on wafer and substrate size and process requirements) |
| Position accuracy of die attach | ± 1 mil (± 25um) |
| Angle accuracy of wafer | ± 1 ° |
| Crystal loss detection function | With (vacuum detection mode) |
| Solid leakage detection function | With (vacuum detection mode) |
| Capacity statistics function | Yes |
| Statistical function of consumables usage | Yes |
| Function of parameter modification record | Yes |
| User privilege management function | Yes |
| Module of wafer worktable |
| Size of the chip | 3milx5mil-60mlx60mil |
| Thickness of the wafer | 0.1-0.7 mm |
| Maximum correction angle of wafer | ± 15 ° |
| Maximum size of wafer and wafer ring | 6“Crystal Ring (152 mm outer diameter) .” |
| Maximum area size of wafer | 4.7“(119 mm) |
| Maximum travel of worktable | 152MMX152MM |
| XY resolution | 0.5 um |
| Thimble height travel in z direction | 3 mm |
| Thimble cap | Single Needle (with) |
| Motor and drive system | Home-made linear motor & Huichuan District Drive |
| Image recognition system |
| Methods of image recognition | 256 grayscale |
| Image resolution | 720 * 540 |
| Accuracy of image recognition | ± 0.025 Mil@50 Mil observed range |
| Foolproof function of chip | Yes |
| Pre-consolidation testing function | Yes |
| Post-consolidation image detection function | Yes |
| Mode of feeding | Automatic connection of incoming and outgoing materials |
| Solid Crystal Swing Arm System |
| The way of fixing crystal | Double Swing Arm 180 ° rotation solidification |
| Suction pressure of crystal | 30g-250g adjustable |
| Manual adjustment of suction nozzle vacuum sensitivity | Yes |
| Module of substrate workbench |
| Mounting speed | 5000-6000UPH |
| Range of travel of worktable | 140mmx620mm |
| Adapt to the width of the substrate | 60-120mm |
| Adapt to the length of the substrate | 100-600mm |
| Thickness of substrate | 0.1-2mm |
| XY resolution | 0.5um |
| Motor and drive system | Home-made Linear Motor & Huichuan District Drive |
| Fixing method of base plate | Manipulator plus vacuum suction platform |
